Apparatus for treating a wafer-shaped article

ABSTRACT

An apparatus for processing wafer-shaped articles comprises a closed process chamber, a chuck located within the closed process chamber, and at least one process liquid dispensing device disposed within the chamber. The closed process chamber comprises a lid that can be opened to position a wafer-shaped article within the closed process chamber. The lid incorporates a heater adapted to heat a wafer-shaped article positioned in the closed process chamber.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates generally to an apparatus for treating a wafer-shaped article, such as a semiconductor wafer.

2. Description of Related Art

Semiconductor wafers are subjected to various surface treatment processes such as etching, cleaning, polishing and material deposition. To accommodate such processes, a single wafer may be supported in relation to one or more treatment fluid nozzles by a chuck associated with a rotatable carrier, as is described for example in U.S. Pat. Nos. 4,903,717 and 5,513,668.

Such spin chucks may be accommodated in closed process chambers, as described for example in commonly-owned co-pending U.S. patent application Ser. No. 12/913,405, filed Oct. 27, 2010. Certain cleaning processes utilize aggressive liquid chemicals at elevated temperatures, as described for example in commonly-owned co-pending U.S. patent application Ser. No. 12/959,924, filed Dec. 3, 2010.

However, when a high temperature process is performed in an environmentally controlled process chamber, it can be difficult to maintain the desired temperature of the process liquid across the surface of the wafer, especially for wafers of relatively larger diameter, such as 300 mm and above.

SUMMARY OF THE INVENTION

An apparatus for processing wafer-shaped articles according to the present invention comprises a closed process chamber, a chuck located within the closed process chamber, and at least one process liquid dispensing device disposed within the chamber. The closed process chamber comprises a lid that can be opened to position a wafer-shaped article within the closed process chamber. The lid comprises a heater adapted to heat a wafer-shaped article positioned in the closed process chamber.

In preferred embodiments of the apparatus according to the present invention, the heater comprises a plurality of infrared heating elements.

In preferred embodiments of the apparatus according to the present invention, the infrared heating elements are individually tuneable to apply a desired heating profile to a surface of a wafer-shaped article positioned within the closed process chamber.

In preferred embodiments of the apparatus according to the present invention, the lid is axially displaceable relative to a remaining structure of the closed process chamber while sealingly engaged with the remaining structure, so as to vary a distance between the heater and a wafer-shaped article positioned within the closed process chamber.

In preferred embodiments of the apparatus according to the present invention, the heater comprises one or a plurality of infrared heating elements, and the lid comprises a downwardly-facing peripheral shield that is essentially opaque to IR radiation.

In preferred embodiments of the apparatus according to the present invention, the lid comprises an internal gas inlet communicating with one or more internal peripheral recesses surrounding the heater, to permit a cooling gas to be supplied adjacent a periphery of the heater.

In preferred embodiments of the apparatus according to the present invention, the internal gas inlet is disposed in a central region of the lid, and is connected to the one or more internal peripheral recesses by a plurality of radially extending channels.

In preferred embodiments of the apparatus according to the present invention, the heater comprises one or a plurality of infrared heating elements, and the lid comprises an internal IR shield separating the one or a plurality of infrared heating elements from the one or more internal peripheral recesses.

In preferred embodiments of the apparatus according to the present invention, the heater is sealed within the lid so as to be protected from contact with process liquids inside the closed process chamber.

In preferred embodiments of the apparatus according to the present invention, the lid comprises at least one gas nozzle opening on or extending beyond a downwardly facing surface of the lid, so as to supply gas into the closed process chamber.

In preferred embodiments of the apparatus according to the present invention, the apparatus includes a drive unit for the at least one process liquid dispensing device, the drive unit being drivingly connected to the at least one dispensing device to move the at least one dispensing device from a peripheral standby position to one or more active positions in which a dispensing end of the at least one dispensing device is moved radially inwardly of the chuck, the drive unit being mounted outside of the chamber.

In preferred embodiments of the apparatus according to the present invention, the chamber is a component of a process module for single wafer wet processing of semiconductor wafers.

In preferred embodiments of the apparatus according to the present invention, the chuck is a spin chuck having a drive shaft extending downwardly from the chamber.

In preferred embodiments of the apparatus according to the present invention, the at least one process liquid dispensing device is operable to dispense liquid into the chamber while the lid is in the closed position.

In preferred embodiments of the apparatus according to the present invention, the chuck is vertically movable relative to the closed process chamber, and is configured to have at least three stopping positions, these being an uppermost position for loading and unloading a wafer-shaped article from the chuck, and at least two lower positions within the chamber, each of the at least two lower positions corresponding to a distinct process level of the chamber.

In preferred embodiments of the apparatus according to the present invention, the apparatus includes a drive mechanism that moves the lid from the closed position to the open position, the drive mechanism being adapted to displace the lid both upwardly and laterally relative to the chamber.

In preferred embodiments of the apparatus according to the present invention, drive unit is a motor mounted on a side housing of the chamber, an output shaft of the motor passing into the side housing and driving a link that passes into the chamber and connects to the at least one liquid dispensing device.

In preferred embodiments of the apparatus according to the present invention, the at least one process liquid dispensing device is a media supply arm pivotably mounted within the chamber and movable from a peripheral standby position to one or more active positions in which a dispensing end of the media supply arm is moved radially inwardly of the chuck.

In preferred embodiments of the apparatus according to the present invention, the media supply arm has one end pivotally connected to a link that passes through a wall of the chamber and an opposite end provided with a dispensing nozzle.

In preferred embodiments of the apparatus according to the present invention, the lid is arranged parallel to a wafer-shaped article received on the chuck.

In preferred embodiments of the apparatus according to the present invention, the closed process chamber comprises a plurality of superposed process levels, each of the plurality of superposed process levels having a respective gas exhaust connected thereto, wherein the gas exhausts are individually controllable.

In preferred embodiments of the apparatus according to the present invention, the closed process chamber is mounted on an upper surface of a base plate, and the apparatus also includes a drive unit for the chuck mounted in a housing that depends from a lower surface of the base plate.

In preferred embodiments of the apparatus according to the present invention, the drive mechanism that moves the lid from the closed position to the open position is mounted on a lower surface of a base plate, and the closed process chamber is mounted on an upper surface of the base plate.

BRIEF DESCRIPTION OF THE DRAWINGS

Other objects, features and advantages of the invention will become more apparent after reading the following detailed description of preferred embodiments of the invention, given with reference to the accompanying drawings, in which:

FIG. 1 is a perspective view of a preferred embodiment of a closed chamber module according to the present invention;

FIG. 2 is a view similar to FIG. 1, in which the chamber lid has been moved up and away from the module, so as to permit loading or unloading of the module;

FIG. 3 is a perspective view of the FIG. 1 embodiment from below, showing several of the mechanisms used to operate the module;

FIG. 4 is another perspective view of the FIG. 1 embodiment, sectioned in an axial plane, so as to illustrate internal components thereof;

FIG. 5 is an axial cross-section of the FIG. 1 embodiment, in the same plane as that of FIG. 4;

FIG. 6 is a perspective view from above of the lid of the FIG. 1 embodiment;

FIG. 7 is a top plan view of the lid, in which the cover is rendered in transparent form;

FIG. 8 is a perspective view from below of the lid of the FIG. 1 embodiment;

FIG. 9 is a cross-sectional view along the line A-A of FIG. 7;

FIG. 10 is a cross-sectional view along the line D-D of

FIG. 7;

FIG. 11 is an axial cross-section of the FIG. 1 embodiment in a plane that intersects the pivotal mounting of one of the media supply arms;

FIG. 12 is a sectional view illustrating the mechanism for driving and raising and lowering the spin chuck of this embodiment;

FIG. 13 is a radial section of the FIG. 1 embodiment, illustrating the media supply arms in their standby position;

FIG. 14 is a fragmentary perspective view of the pivotal mounting of one of the media supply arms;

FIG. 15 is a radial section of the FIG. 1 embodiment, in which one of the media supply arms has been pivoted to its service position; and

FIG. 16 is a perspective view of the FIG. 1 embodiment, with the upper chamber cover removed.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Referring to FIG. 1, a closed chamber module 10 is mounted on a base plate 15, and is constituted by a preferably cylindrical chamber wall 30 and an annular upper chamber cover 32 secured to the chamber wall 30 by a series of screws or the like. The chamber module 10 is closed at its upper end by a lid 100, which seals at its outer periphery to the inner periphery of the annular upper chamber cover 32.

Lid 100 is secured to lid arm 22, which moves the lid 100 from the closed position shown in FIG. 1 to the open position shown in FIG. 2, and which is in turn positioned on lid support shaft 26. A gas feed line 24 supplies gas to the lid 100. In practice a plurality of gas feed lines may be provided.

First and second drive units 52, 62 are provided for respective media supply arms to be described below, and lead to respective covers 54, 64 for the pivotal movement mechanisms for the media supply arms. Reference numeral 56 denotes a lead-in for the first media supply line.

The closed chamber module of this embodiment has three interior levels, each of which has an associated gas exhaust, with reference numerals 82, 84 and 86 in FIG. 1 denoting the associated exhausts for the lower, middle and upper levels, respectively and 81, 83 and 85 denoting the associated lower, middle and upper gas suctions for those exhausts.

Referring now to FIG. 2, the closed chamber module is shown in its open position, which involves both raising the lid upwardly relative to the chamber and pivoting it about the lid support shaft 26, which accommodates the hollow shaft 18.

Inside the chamber, spin chuck 70 is visible, which in this embodiment is a chuck of the double-sided type. Also visible are the second media supply arm 63 in its standby position, and upper, middle and lower levels 34, 35, 36.

In FIG. 3, the underside of the lid 100 includes a central gas nozzle 23.

Motor 27, which may for example be a pneumatic cylinder, drives link 19, which in turn drives hollow shaft 18 (see FIG. 4). Motor 27 thus drives the pivotal movement of lid 100. Motor 28 is a lifting motor for raising and lowering the lid 100, whereas 29 denotes a lead-in for the gas feed lines 21, 24 that are accommodated in the hollow shaft 18.

A spin motor 72 spins the spin chuck 70, whereas motor 76 raises and lowers spin chuck 70 via slider 74. A lower chamber cover 31 accommodates the bellows of the spin chuck, as will be described below.

In FIG. 4, the upper, middle and lower levels 34, 35 and 36 are more readily visible. The structure of these levels and their respective exhausts 86, 84 and 82 may be as described in commonly-owned application WO 2004/084278 A1. Also visible in FIG. 4 is the gas feed line 21 for the central gas nozzle 23, an expansion bellows 75 that serves to isolate the drive mechanisms from the interior ambient of the chamber, a frame 77 that connects the chuck drive mechanism to the underside of the chamber, a non-rotating nozzle head 79 supplying the bottom nozzles of the chuck, and a non-rotating hollow shaft 78 accommodating the bottom nozzle head 79.

The axial cross-section of FIG. 5 shows the afore-mentioned components in greater detail, along with the plate 37 defining the chamber bottom, the first media supply arm 53 shown in its standby position, and the stowage area 55 for the arm 53. It will be noted that shaft 18 is rigidly secured to lid arm 22, such that the rotational and translational movements imparted to shaft 18 are imparted to lid arm 22 and lid 100 as well, as described below.

Lid 100 is depicted in greater detail in FIGS. 6-10. A plurality of electrical connectors 122 are provided for the heating lamps 120. The upper cover of lid 100 is normally optically opaque but is rendered in transparent form in FIG. 7, to reveal the infrared lamps 120 and the ribs 115, between which the channels of the cooling gas distribution network are established.

As shown in FIGS. 7-9, lid 100 includes twelve linear infra red (IR) heaters 120. The IR-heaters are separately tunable, so as to achieve a desired uniformity of heating across the wafer surface. For example, if it is found out that the wafer edge is not heated fast enough the power to the outermost IR-heaters 120 is increased. The tuning of the IR-heaters can be optimized by monitoring the treated wafers regarding the uniformity of heating or by monitoring the temperature increase using local thermometers.

The IR-heaters are preferably linear quartz rods. There is an isolative coating provided so that the IR-heaters primarily emit IR-light towards the wafer surface.

The chamber and the IR-heaters are separated by a transparent plate 135, e.g. made of heat resistant glass (borosilicate glass), or quartz. Surrounding transparent plate 135 is an annular peripheral shield 125, which is formed of stainless steel or another material that is essentially opaque to infrared radiation. Shield 125 thus serves to focus the IR radiation onto the wafer surface and prevents the surrounding parts (e.g. the chamber walls), which are often made from a plastic material, from being excessively heated.

The assembly of IR heaters 120 is sealed within the lid 100 so that process liquid inside the sealed chamber cannot make contact with the IR heaters 120. This can be important for example when the process liquid is flammable, for example in the case of hot isopropyl alcohol used during drying treatments.

Although the heating elements in this embodiment are linear tubes, the heating elements may alternatively be embodied as tunable spot type IR lamps or concentric annular heating elements.

As shown in FIG. 10, the lid 100 in this embodiment comprises an outer plate 130 and also an inner plate 136. Inner plate 136 is preferably also an IR shield. Between the outer plate and the inner plate there is a gas distribution chamber 133 that is purged with cooling gas (preferably an inert gas such as nitrogen). The cooling gas is introduced through feed pipe 129 and distributed to six radially arranged gas distribution chambers 133 through channels 131 that are defined by ribs 115. The ribs 115 are part of the outer plate 130 and are arranged like spokes radiating from the center of lid 100. As FIG. 9 is a cross-section through one of the ribs 115, the gas distribution network is better seen in FIG. 10.

Lid 100 in this embodiment is also axially displaceable relative to lid arm 22, by virtue of its mounting thereto via a series of six rods 103 that are rigidly secured to lid 100 but whose enlarged heads 104 are captive within pockets formed in lid arm 22, and in which they may slide axially upwardly against the force of springs 105 that surround the rods 103 and that bear via their upper ends on lid arm 22 and via their lower arms on the outer cover 133 of lid 100. A suitable gear motor or the like (not shown) can thus vary the spacing between the lid 100 and lid arm 22, and thus the spacing between the set of IR heating elements 120 and the upper surface of a wafer positioned with the process chamber. This axial positioning thus permits further tuning of the heating profile to be applied to a wafer.

In the axial cross-section of FIG. 11, the sectioning plane passes through the cover 54 of the pivot mechanism for the first media supply arm 53. From this angle, the second media supply arm 63 is fully visible in its standby position. Reference numeral 17 denotes a pressure-equalizing chamber with the lid 100. An annular seal 33 such as an O-ring or V-seal is attached to or seated in the annular upper chamber cover 32, to form a seal with the lid 100. However, when the lid 100 is axially displaceable relative to the lid arm 22, then the cylindrical side surface of lid 100 is adapted to remain sealingly engaged with upper chamber 32 throughout the range of axial travel of lid 100 relative to lid arm 22.

Turning now to FIG. 12, the mechanism for rotating the spin chuck carrier 73 comprises a rotating hollow shaft 71 that drives the spin chuck carrier 73 in rotation, the expansion bellows 75 that shields the drive mechanisms from the interior ambient of the chamber, frame 77 connecting the chuck drive mechanism to the underside of the chamber, non-rotating nozzle head 79 supplying the bottom nozzles of the chuck, and non-rotating hollow shaft 78 accommodating the bottom nozzle head 79.

Non-rotating hollow shaft 90 surrounds rotating hollow shaft 71, which in turn surrounds non-rotating hollow shaft 78, these three shafts being coaxial with one another. Rotary shaft seal bearing 91 seals the coaxial shafts from the chamber ambient and supports the interconnected rotary hollow shaft 78 and chuck carrier 73, whereas bearing 92 connects the non-rotating upper ring 94 with the rotating shaft 71. Membrane cover 93 is fitted within lower chamber cover 31, and at its inner periphery seals against bellows 75, and at its outer periphery seals against the chamber bottom 37.

In FIG. 13, the radial section through the cylindrical chamber wall 30 reveals first and second media supply arms 53 and 63 in their standby position, with the broken lines in FIG. 8 tracing the arcuate path that the dispensing ends of the media arms 53, 63 travel as they are moved from the illustrated standby position to the service position in which the dispensing end of the media arm will be approximately centered over the spin chuck. In practice only one of the media arms will be in use and hence in its service position at any given time, that is, although the media supply arms 53, 63 will often both be in the standby position as illustrated, in use typically only one or the other will be in the service position. Nevertheless, both media supply arms 53, 63 can move simultaneously, however alternatively approaching the centre, which can be achieved by appropriate software commands.

In referring to a service position for the media supply arms 53, 63, it will be understood that there can be more than one service position, or for that matter the arms may be in service as they move radially inwardly from the peripheral standby position. Therefore, the service position can refer to any position where the dispensing end of the media supply arm is positioned above a wafer supported on the chuck, and not merely the central innermost position. For instance the service position will move from centre towards the edge and back again during processing of the wafer.

FIG. 14 shows further detail of the mechanism for driving the media supply and dispense arms between their standby and service positions. Cover 64 is indicated only in broken line in FIG. 14, to permit viewing the interior components of the drive mechanism. In practice cover 64 will be made of a solid material mounted in a sealed manner to the cylindrical wall 30 of the chamber, the cylindrical wall 30 having a cutout surrounded by the cover 64 to permit passage therethrough of the link 67 that carries the second media arm 63 on its distal end and which is connected to the output shaft 68 of drive unit 62 for example by a splined connection. Output shaft 68 penetrates cover 64 from below via a sealed bearing, thus drive unit 62 is disposed outside the chamber and is protected from the harsh chemical environment that exists within the chamber.

Thus, when drive unit 62 is actuated, link 67 will be pivoted over a range of motion dictated by the operating cycle of the drive unit 62, and which corresponds to displacement of the media supply arm 63 from its standby position to its service position. The size of the cutout in the cylindrical chamber wall 30 is therefore sized to accommodate that range of pivotal motion.

Lead-in 66 connects to the second media line 61 inside the chamber. Lead-in 66 may for example be a fluid coupling that traverses the cylindrical wall 30 of the chamber in a sealed manner, connecting to inlet tubing at its end outside the chamber and to second media line 61 at its end inside the chamber.

Also visible in FIG. 14 is an interior chamber wall positioned radially inwardly of cylindrical chamber wall 30, which together with wall 30 defines the stowage area 65 for the second media supply arm 63. That interior wall is provided with a cut-out 69 to permit passage of the downwardly-depending dispensing end of the media supply arm 63 as it is moved from its standby position in stowage area 65 to its service position in which the dispensing end of arm 63 is positioned above the center of the spin chuck.

It will be appreciated that first and second media supply arms 53 and 63 are equipped with essentially the same drive mechanisms in this embodiment, such that the description of the various components of one unit applies also to the other, although such description might not be repeated herein. Moreover, although the present embodiment of the invention is equipped with two media dispense arms, the number of such arms and their associated drive mechanisms could be only one, or, conversely, could be three or more.

In FIG. 15, the first media arm 53 remains in its standby position, whereas second media supply arm 63 has been pivoted to the service position, in which the downwardly depending dispense nozzle of the arm 63 is positioned above the center of the spin chuck. Second media line 61 is more visible with arm 63 in its service position. That line 61 is depicted schematically in FIG. 15, but it will be seen that the length of line 61 is sufficient to accommodate the range of motion of the radially inward end of link 67, and so too its flexibility.

The perspective view of FIG. 16 corresponds to FIG. 15 and shows cover 54 in place whereas cover 64 is removed to reveal the drive linkage for media arm 63.

In use, the chamber will be opened to permit loading a wafer to be processed therein. This involves first actuating the motor 28, which is fixed by posts to the underside of base plate 15 and stationary relative thereto (see FIG. 3), but whose output shaft when extended causes lead-in 29 to be displaced upwardly, and with it the shaft 18, lid arm 22 and lid 100. Shaft 18 is preferably journaled in the lead-in 29 such that it is raised with the lead-in, but is rotatable relative to the lead-in 29.

Once the lid 100 has been raised to open the chamber, motor 27 is next actuated to drive link 19 in an arcuate range of motion about the axis of shaft 18. As link 19 is non-rotabably secured to shaft 18, this motion rotates shaft 18 and with it lid arm 22 and lid 100, such that the lid 100 is swung away from the opening defined by the upper annular chamber cover 32, to the position shown in FIG. 2. As shown in FIG. 3, motor 27 is itself mounted to the underside of base plate 15 via a pivot, to allow the pivotal motion of the link 19. Link 19 may be splined to shaft 18 and slide relative thereto during vertical displacement of shaft 18 driven by motor 28, or link 19 may be secured fast to shaft 18, and be driven by motor 27 at its opposite end via a pivot connection on which it may slide vertically when motor 28 is operated.

After the chamber has been opened as shown in FIG. 2, a wafer to be processed is loaded therein. Apparatus for transporting and loading wafers onto spin chucks are well known in the art. To receive a wafer, motor 76 is actuated to raise the spin chuck 70 via slider 74 to a position in the vicinity of the opening defined in the upper annular chamber cover 32. In particular, the spin chuck 70 may be raised to a position where it is just below the opening in cover 32, just above that opening, or flush with that opening.

It will be noted that the diameter of the opening in the upper annular cover 32 must obviously be greater than the outer diameter of a wafer to be processed in the chamber, but is preferably not of substantially greater diameter. For example, in the case of a 300 mm silicon wafer, the opening in cover 32 preferably has a diameter of approximately 320 mm. In general, the diameter of the opening in the upper end of the chamber should not exceed the diameter of a wafer to be processed by more than 50%, preferably by not more than 20%, and still more preferably by not more than 10%.

Spin chuck 70 is adapted to hold a wafer of a predetermined diameter, in this case 300 mm. Spin chuck 70 includes a peripheral series of gripping pins, which prevent the wafer from sliding laterally during processing. When spin chuck 70 is implemented as a Bernoulli chuck, a nitrogen gas flow supplied through the chuck and passing radially outwardly beneath the wafer provides the subjacent support of the wafer. Alternatively, the gripping pins may be configured with radially inwardly-facing surfaces that hold the wafer in its working position relative to the chuck, e.g. by having a shape complementary to the peripheral edge of the wafer, thereby providing both lateral and subjacent support.

Spin chuck 70 is then lowered by motor 76 to a working position at one of the upper, middle and lower levels 34, 35, 36, whereafter spin motor 72 commences to spin the spin chuck 70. Any desired combination of liquids and gases can then be supplied to the chamber interior, the liquids via media supply arms 53, 63 and the gases via lid 100.

It is preferred that one or more of the seals that seal the chamber be designed so as to permit controlled leakage of gas exteriorly of the chamber at a predetermined level of overpressure. In that way, a substantially oxygen-free atmosphere can be maintained within the chamber during processing of a wafer, while continuing to supply gas from lid 100 and/or through the shaft 78 without accumulation of excess pressure. This design also permits exclusion of oxygen without the need to rely upon the use of vacuum or the maintenance of completely impervious seals.

It will be appreciated that the design of this embodiment permits the lid and the media supply arms to supply gas and liquid simultaneously to the chamber interior. Furthermore, the design of the media supply arms 53, 63 and their associated drive mechanisms permits the arms to be disposed inside the chamber whereas their respective drive units are mounted outside the chamber. This provides the considerable advantage of preventing exposure of those drive units to the very aggressive chemicals often used in such processing modules.

While the present invention has been described in connection with various illustrative embodiments thereof, it is to be understood that those embodiments should not be used as a pretext to limit the scope of protection conferred by the true scope and spirit of the appended claims. 

1. Apparatus for processing wafer-shaped articles, comprising a closed process chamber, a chuck located within said closed process chamber, and at least one process liquid dispensing device disposed within said chamber, said closed process chamber comprising a lid that can be opened to position a wafer-shaped article within said closed process chamber, said lid comprising a heater adapted to heat a wafer-shaped article positioned in the closed process chamber.
 2. The apparatus according to claim 1, wherein said heater comprises a plurality of infrared heating elements.
 3. The apparatus according to claim 2, wherein the infrared heating elements are individually tuneable to apply a desired heating profile to a surface of a wafer-shaped article positioned within said closed process chamber.
 4. The apparatus according to claim 1, wherein said lid is axially displaceable relative to a remaining structure of said closed process chamber while sealingly engaged with said remaining structure, so as to vary a distance between said heater and a wafer-shaped article positioned within said closed process chamber.
 5. The apparatus according to claim 1, wherein said heater comprises one or a plurality of infrared heating elements, and wherein said lid comprises a downwardly-facing peripheral shield that is essentially opaque to IR radiation.
 6. The apparatus according to claim 1, wherein said lid comprises an internal gas inlet communicating with one or more internal peripheral recesses surrounding the heater, to permit a cooling gas to be supplied adjacent a periphery of said heater.
 7. The apparatus according to claim 6, wherein said internal gas inlet is disposed in a central region of said lid, and is connected to said one or more internal peripheral recesses by a plurality of radially extending channels.
 8. The apparatus according to claim 6, wherein said heater comprises one or a plurality of infrared heating elements, and wherein said lid comprises an internal IR shield separating said one or a plurality of infrared heating elements from said one or more internal peripheral recesses.
 9. The apparatus according to claim 1, wherein said heater is sealed with said lid so as to be protected from contact with process liquids inside said closed process chamber.
 10. The apparatus according to claim 1, wherein said lid comprises at least one gas nozzle opening on or extending beyond a downwardly facing surface of said lid, so as to supply gas into said closed process chamber.
 11. The apparatus according to claim 1, further comprising a drive unit for the at least one process liquid dispensing device, the drive unit being drivingly connected to the at least one dispensing device to move the at least one dispensing device from a peripheral standby position to one or more active positions in which a dispensing end of the at least one dispensing device is moved radially inwardly of the chuck, said drive unit being mounted outside of said chamber.
 12. The apparatus according to claim 1, wherein the chamber is a component of a process module for single wafer wet processing of semiconductor wafers.
 13. The apparatus according to claim 1, wherein the chuck is a spin chuck having a drive shaft extending downwardly from the chamber.
 14. The apparatus according to claim 1, wherein said at least one process liquid dispensing device is operable to dispense liquid into the chamber while said lid is in the closed position.
 15. The apparatus according to claim 1, wherein said chuck is vertically movable relative to said closed process chamber, and is configured to have at least three stopping positions, these being an uppermost position for loading and unloading a wafer-shaped article from the chuck, and at least two lower positions within the chamber, each of said at least two lower positions corresponding to a distinct process level of said chamber. 